To Technetters:  I would like to hijack Phils response due to the fact  he is 
in the design characterization of SMT product.  I am employed by a  contract 
mfg. and have been placing 0402 components quite successfully now for  approx. 
4 years but the dreaded 0201 component package is beginning to raise  it's 
head through two of our major customers.
 
My questions are:
 
     1) What is typical for the stencil thickness when  placing 0201 
components?  What if the components are of various types and  sizes?
 
     2) I have read that some stencil aperatures are  more successful than 
others.  What are folks typically using now?  
 
     3) If the PCB is of mixed technology(SMT and T/H),  does anyone have 
experience wave soldering after 
placing 0201 packages in SMT operations?
 
I'd rather not have to re-invent the wheel if I don't have to and I know  
that folks have been placing 0201 now for years.  I'd appreciate any  suggestions 
that you Technetters have to offer.
 
Thanks again,
Bill Black
Medco
e-mail:  [log in to unmask] (mailto:[log in to unmask]) 



**************************************Check out AOL's list of 2007's hottest 
products.
(http://money.aol.com/special/hot-products-2007?NCID=aoltop00030000000001)

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------