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November 2007

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Wed, 14 Nov 2007 15:06:38 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Leland Woodall <[log in to unmask]>
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Leland Woodall <[log in to unmask]>
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Victor and Technetters,

The components I mention below are Nichicon SMT capacitors used within a
lead-free reflow process.  The majority of the leads are beneath the
component, making heat transfer the absolute devil to accomplish.

The three removal methods I referenced as currently being used include:

1.  Dual solder iron heat transfer, with the irons being placed at each
point for 90 to 120 seconds (concern with pad lift)

2.  IC removal tool (concern with reflow of adjacent components)

3.  Physical twisting of component, separating body from terminations
(again, concern with lifted pads)

In other words, I'm not really satisfied with any of our current
techniques, but I also haven't been able to locate a lot of alternative
(and effective) methods.

Repair is not my specialty either, but some of our folks have asked me
to look into this.  Any help would be sincerely appreciated!

Leland

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Wednesday, November 14, 2007 2:47 PM
To: [log in to unmask]; Leland Woodall
Subject: RE: [TN] E-cap Removal Technique

Can you share these methods with me?   I am not involved with rework but
curious with the technique.   The technique gives credence to the solder
fillet when conducting x-ray imaging and cross sectional analysis.   Are
the leads reflowed at two different temperatures?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Wednesday, November 14, 2007 9:03 AM
To: [log in to unmask]
Subject: [TN] E-cap Removal Technique

Everyone,

In your experience, what is the best method you've found to remove
aluminum electrolytic capacitors from an assembly?

We currently have about three different methods being used, and I'd
really like to try to standardize the operation...

Thanks in advance,

Leland Woodall

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