Hi Victor,
'Hole wall dielectric/plated barrel separation', popularly, but incorrectly
called 'resin recession', afterthermal stress is acceptable for all 3 Classes.
While barrel/hole wall separations do not pose reliability problems, they are
in indication of larger tensile stresses on inner lands—and may be an
indicator of possible partial innerlayer separations. This has become much more
important with the high soldering temperatures required under RoHS.
Werner
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