Hi guys its me again,
We have a customer that builds power systems for the Telcom companies.
They recently had a field failure on a backplane. It had sever corrosion.
We process the assembly with a VOC no-clean solder and have never had
issues in the past. The customer indicated that the backplane was in a
damp/moist environment. That is not a good combination for no clean flux.
I suggested cleaning but they insisted that we monitor our flux volume to
ensure it is at the recommended application volume. I did not really agree
from a reliability standard.
Does anyone out there measure their no clean flux volume on a regular
basis?
Joel Alexander
Quality Assurance Manager
TT APSCO, INC.
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