I have never heard of an exemption of that nature.
Homogeneous:
"A material of uniform composition throughout, that cannot be, in
principle, mechanically disjointed or separated by mechanical actions
such as unscrewing, cutting, crushing, grinding or abrasive processes."
First of all, the encapsulation with an assembly inside is not of
uniform composition throughout, so it is not a homogeneous substance.
Secondly, ask yourself, is it THEORETICALLY possible to separate the
assembly from the encapsulation? (I am not talking practical, only
theoretical). If so, then 'no', the assembly needs to be evaluated
separately from the encapsulation. This goes right down to the plating
on the leads of a component - it needs to be evaluated separately from
the metal it was plated onto.
That is how I understand the EU RoHS.
However, the China RoHS is slightly different in the area of
homogeneity.
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: November 7, 2007 1:09 PM
To: [log in to unmask]
Subject: Re: [LF] RoHS Requirements for 1st Level Interconnect
If a circuit board assembly or component is encapsulated or hermetically
sealed so that any lead or prohibited substances cannot leach out, is it
exempt?
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]
Sent: Wednesday, November 07, 2007 1:02 PM
To: [log in to unmask]
Subject: Re: [LF] RoHS Requirements for 1st Level Interconnect
It depends (ka-ching...).
Generally speaking, the RoHS directive applies to everything - every
homogeneous part of the component.
However, there are some exemptions that typically apply to materials you
usually only find at the 2nd level interconnect, which is why it may
seem like it doesn't apply to 2nd level interconnects. For example:
Lead in high melting temperature type solders (i.e. tin-lead alloys
containing more than 85% lead).
This is often used at the 2nd level interconnect.
However, if one of the other restricted substances was found at the 2nd
level interconnect, the component would definitely not comply.
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Al Cummins
Sent: November 7, 2007 11:40 AM
To: [log in to unmask]
Subject: [LF] RoHS Requirements for 1st Level Interconnect
Does the RoHS Directive apply to both 1st and 2nd level PCB
interconnects, or just 2nd level? I originally thought it applied to
both but I have seen articles that imply it only applies to 2nd level
(board level) only and not wire bonds etc.
Thanks,
Al Cummins
Compliance Engineer
Ixia
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