Dear technet,
I am looking at quantifying the risk associated with a SnPb PCBA mistakenly
processed under RoHS reflow condition and would like to collect some input on
what I would expect to see on the result. This may include having the board
destructive tested.
In general, what would be the impact on a non-rohs PCBA (normal FR4, SnPb
solder paste used in assembly) if a rohs process (i.e. elevated reflow temp)
was applied? Aside from impact to components, how would the elevated
temperature pose risk to solder joint integrity and PCB reliability?
Any input is appreciated.
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