To Technetters: I would like to hijack Phils response due to the fact he is
in the design characterization of SMT product. I am employed by a contract
mfg. and have been placing 0402 components quite successfully now for approx.
4 years but the dreaded 0201 component package is beginning to raise it's
head through two of our major customers.
My questions are:
1) What is typical for the stencil thickness when placing 0201
components? What if the components are of various types and sizes?
2) I have read that some stencil aperatures are more successful than
others. What are folks typically using now?
3) If the PCB is of mixed technology(SMT and T/H), does anyone have
experience wave soldering after
placing 0201 packages in SMT operations?
I'd rather not have to re-invent the wheel if I don't have to and I know
that folks have been placing 0201 now for years. I'd appreciate any suggestions
that you Technetters have to offer.
Thanks again,
Bill Black
Medco
e-mail: [log in to unmask] (mailto:[log in to unmask])
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