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Date: | Sat, 6 Oct 2007 12:42:03 -0400 |
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At the last IPC EXPO, I presented a paper that mathematically models the
electroplating process for through holes using the Navia Stokes equations
for fluid flow and Faraday's law for electroplating . The parameters of
first order importance which were identified by this analysis are (hole
diameter/aspect ratio)-squared (not aspect ratio alone), current density,
concentration and agitation speed. Unfortunately, most of these parameters
suggest that improvements in the hole wall uniformity require additional
expense. As we all know, improved reliability, often requires a more
expensive process.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
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