TECHNET Archives

October 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Sat, 6 Oct 2007 12:42:03 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
At the last IPC EXPO, I presented a paper that mathematically models the 
electroplating process for through holes using the Navia Stokes equations 
for fluid flow and Faraday's law for electroplating . The parameters of 
first order importance which were identified by this analysis are (hole 
diameter/aspect ratio)-squared (not aspect ratio alone), current density, 
concentration and agitation speed. Unfortunately, most of these parameters 
suggest that improvements in the hole wall uniformity require additional 
expense. As we all know, improved reliability, often requires a more 
expensive process.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2