Hi, 
in our Pb-free soldering world, you are not likely to get away with 0.8 mils 
in a via, except for very thin PWBs even 1.0 mils is inadequate for many 
designs and specifications of 1.2/1.3 mils are not uncommon today.
Plating thickness in the hole is first of all a matter of time [=money]. Of 
course, as the hole diameter shrinks, plating half-way decent copper in the 
hole becomes more difficult—pulse plating and impingment plating can drive 
plating further, but mass transport limited plating becomes the limiting factor 
sooner or later.

Werner



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