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Subject:	Re: IPC potting guidelines
From:	"Green, Mike" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Green, Mike
Date:	Thu, 4 Oct 2007 14:33:29 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (62 lines)

IPC-J-STD-001D paragraph 10.2 provides the basic requirements for
encapsulation.

IPC-A-610D has some pictures at@
7.3.3 Component Securing - Adhesive Bonding - Elevated Components

Mike Green
Electronic Packaging Design
LMCO-Sunnyvale
408-743-1635
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Crawford
Sent: Wednesday, October 03, 2007 3:06 PM
To: [log in to unmask]
Subject: Re: [TN] IPC potting guidelines

IPC/WHMA-A-620 Rev A, July 2006, Requirements and Acceptance for Cable
and Wire Harness Assemblies, has three pages:
10.2 Potting
10.2.1 Filling
10.2.2 Fit to Wire or Cable
10.2.3 Curing

Jack

Jack Crawford, IOM
IPC Director Certification and Assembly Technology
[log in to unmask]
847-597-2893
FAX  847-615-5693
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karl Hunsinger
Sent: Wednesday, October 03, 2007 3:28 PM
To: [log in to unmask]
Subject: [TN] IPC potting guidelines

Hi all,
    Could anyone tell me if there is any IPC spec or guidelines that
cover potting? We typically use Eccobond to pot connectors and connector
patterns.
 
Thanks in advance...

Karl Hunsinger 
Project Engineering 
Flexible Circuits Inc. 
215-343-2300 X5154 

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