In truth, it is my understanding that the flux was changed because nobody
uses pure rosin flux anymore. They only reason the flux makers produced it
was for solderability testing.
The new flux specification was supposed to reflect real world performance
requirements. We are using an L0 flux. But, I am sure it performs much
better, in the real world than the material specified in previous revision
of the standard; False calls.
Though, I suspect that someone using pure rosin flux could have issues with
components that pass the current tests.
Dave?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Wednesday, October 31, 2007 2:32 PM
To: [log in to unmask]
Subject: Re: [TN] Flux
Guys,
I am vice chairman of the 5-23b committee on solderability with Dave
Hillman as the chairman. I do not officially remember why this was
changed, but it was for a reason - not willy-nilly. My suggestions are
either:
1. Because of some change in the J-004 standard on flux, or 2. The changed
flux reduced the chance of false calls in the test.
I have a reinforcing note to Dave Hillman to get you an answer. And,
please review the information still carried on the committee web site:
_http://members.ipc.org/commReg/CommRegFile.asp?PDFTYPE=min&ComName=Componen
t%
20and%20Wire%20Solderability%20Specification%20T.G&comm=5-23B_
(http://members.ipc.org/commReg/CommRegFile.asp?PDFTYPE=min&ComName=Componen
t%20and%20Wire%20
Solderability%20Specification%20T.G&comm=5-23B)
From a quick scan, I don't see where this change is called out in the
minutes. Again, you can review most any of the IPC committtee work, by
going as
follows:
1. IPC Web page
2. Standards (that is under the Knowledge header) 3. Standards Development
4. Committee Home pages 5. Then, you have to be somewhat familiar with the
IPC committee structure to know where to search. Assembly standards tend to
all be under committee 5-20 Assembly and Joining. J-002 is under Committee
5-23B.
6. Try it and you will like it (Dr. Suess).
Denny Fritz
MacDermid, Inc.
In a message dated 10/31/2007 1:32:03 P.M. Eastern Daylight Time,
[log in to unmask] writes:
New consensus . . . Who sits on these committees?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Sue Powers-Hartman
Sent: Wednesday, October 31, 2007 12:36 PM
To: [log in to unmask]
Subject: [TN] Flux
The new JStd-002B 3.2.2 states that ROL1 flux shall be used for
solderability testing, while the old Rev JStd-002A 3.2.2 calls out ROL0
Flux. Does anyone know why this was changed?
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