Terry
Long time no hear!
Brian
Terry L. Munson wrote:
> Dewey
>
> I would also add to that list
>
> * Circuit Sensitivity
>
> * Component Geometries (where are the entrapment opportunities)
>
> * specialized components such as QFN or PQFN packages
>
> * cleaning pressures (low pressure with a saponifier is much more effective
> than high pressure with water)
>
> * cleanliness measurement total board vs. localized area
>
> * Base surface finish (silver is more susceptible than ENIG)
>
> * Soldermask porosity (some masks have a greater level of porosity and
> therefore hold more residue requiring a greater cleaning energy)
>
>
> Terry Munson
> Foresite Inc.
>
> 765-457-8095
>
>
>
>
>
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