Dewey
I would also add to that list
* Circuit Sensitivity
* Component Geometries (where are the entrapment opportunities)
* specialized components such as QFN or PQFN packages
* cleaning pressures (low pressure with a saponifier is much more effective
than high pressure with water)
* cleanliness measurement total board vs. localized area
* Base surface finish (silver is more susceptible than ENIG)
* Soldermask porosity (some masks have a greater level of porosity and
therefore hold more residue requiring a greater cleaning energy)
Terry Munson
Foresite Inc.
765-457-8095
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