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October 2007

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Mon, 29 Oct 2007 11:43:46 -0700
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Yes and a few additional requirements.
Yes and /129 also.
It depends (cha-ching).
Yes.
Yes.
1.5 mil avg. with 1.2 mil minimum.

Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Monday, October 29, 2007 10:28 AM
To: [log in to unmask]
Subject: [TN] Bare-Board Materials for Lead-Free Soldering

I'm hoping to get an informal poll of fabricators and people who specify
bare board materials.

There's been a lot of literature and presentations lately that
recommend numbers for better material performance under the higher
soldering
temperatures.

IPC-4101/126
Tg=170 or higher
Td=340 or higher
maximum expansion 3%
etc.

I'm not questioning the wisdom of the numbers, I'd just like to know
whether
everyone (who is doing lead free soldering) is really USING these
numbers?
Or this material? Is there no wiggle room anymore? (EVERY example I see
now,
lists /126 material)

I've also been advised to use a thicker minimum hole wall thickness than
before. Is that common now? >1mil?

thanks,
Jack

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