Thanks Peer,
so it's not the plating 8-{
Have to play a little bit more with the reflow, forgotten to mention the connector is SMT.
Regards,
Ioan
-----Original Message-----
From: P. Langeveld [mailto:[log in to unmask]]
Sent: Friday, October 26, 2007 10:48 AM
To: TechNet E-Mail Forum; Tempea, Ioan
Subject: Re: [TN] Component pins plating thickness
Ioan,
The answer is 2-fold:
1. The measured finish layers are OK. The manufacturers spec however
are, too lean. Already in the lead age the Ni-layer should be 0.002
mm (80 microin), the minimum Sn thickness 0.005 mm (200 microin).
Otherwise the risk of the Sn layer is not hermetic sealing the Ni
layer and the latter can be oxidized. And give wetting problems, and
even more in PTH's.
2. I presume the connector is wave soldered at say, 265 dC.
The (matte) tin has a melting point of 231 dC. Added with the thermal
mass of the internal metal contact lips and other internal heat sinks
in the board, the (total) contact time on the wave(s) has to be
increased with about 1 second.
Success.
Peer Langeveld
Consultant Soft Soldering Processes
5502 VH 8 The Netherlands
2007/10/26, Tempea, Ioan <[log in to unmask]>:
> Hi Technos,
>
> I'm having a tough connector here, hard time to get all the pins soldered.
>
> It is matte Sn over Ni finished, measured coating thicknesses are 250 microinch Sn over 80 microinch Ni. Are these values OK? Isn't the Ni too thin and the Sn too thick?
>
> The manufacturer spec is 0.001mm (40 microin) minimum Sn over 0.0013 (51 microin) minimum Ni.
>
> Thanks for your input,
>
> Ioan
>
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