We have experienced similar issues with delamination of PCBs designed for
lead free and used in lead free processes.

We have also received input  from some of our PCB suppliers as well as
laminate makers on these  moisture issues. We are also currently
overhauling the manner in which we track, store, and handle PCBs in our
processes.

Here is a sample of the guidance that Isola gives:
http://www.isola-group.com/images/file/TechnicalBulletinleadfreeprocedures091207.pdf

Thanks,


Cheryl Tulkoff
Senior Reliability Engineer
Phone:(512) 683-8586
Fax: (512) 683-8520
National Instruments
11500 N. Mopac Expressway
Building C
Austin, TX 78759-3504




                                                                           
             Guy Ramsey                                                    
             <gramsey@RDCIRCUI                                             
             TS.COM>                                                    To 
             Sent by: TechNet                                              
             <[log in to unmask]>                                          cc 
                                                                           
                                                                   Subject 
             10/23/2007 11:32          Re: [TN] Delamination of lead free  
             AM                        PCBs                                
                                                                           
                                                                           
             Please respond to                                             
             gramsey@rdcircuit                                             
                   s.com                                                   
                                                                           
                                                                           




yes

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Alexander
Sent: Tuesday, October 23, 2007 12:23 PM
To: [log in to unmask]
Subject: [TN] Delamination of lead free PCBs

Has anyone experienced an increase of delamination when processing in a
lead
free environment. Typically 4 to 6 layer pcbs during SMT reflow. We are
using the high temp laminate suggested for our process. When we contacted
the supplier and they indicated that any PCBs that are over six months old
should be baked prior to processing. This was never required with leaded
PCBs.

Is anyone seeing the same condition and similar feedback from your PCB
suppliers



Joel Alexander
Quality Assurance Manager
TT APSCO, INC.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------