Hi Joel,
Welcome to the never-never RoHS-world.
There are 2 possible reasons for PCB base material delamination in Pb-free 
soldering: (1) thermal decomposition of the resin, (2) excessive water vapor 
pressure.
In your case, it seems root cause (2) since you did not bake, but you cannot 
rule out (1).
You need to consider, that the same moisture content results in doubling the 
vapor pressure at the higher Pb-free soldering temperatures.
You say that you are "using the high temp laminate suggested for our process"—
who suggested the laminates?
I wrote a White Paper "Recommendations for PCB FAB Notes and Specifications 
in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, 
the Qualification of PCB Shops and Activities to Assure Continued Quality" and 
give a full day workshop on this subject matter [see details on both on my 
website] because of the problems the industry has experienced.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com



**************************************
 See what's new at http://www.aol.com

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------