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October 2007

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Subject:
Re: Delamination of lead free PCBs
From:
Guy Ramsey <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Tue, 23 Oct 2007 12:32:21 -0400
Content-Type:
text/plain
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text/plain (48 lines) 
yes 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Alexander
Sent: Tuesday, October 23, 2007 12:23 PM
To: [log in to unmask]
Subject: [TN] Delamination of lead free PCBs

Has anyone experienced an increase of delamination when processing in a lead
free environment. Typically 4 to 6 layer pcbs during SMT reflow. We are
using the high temp laminate suggested for our process. When we contacted
the supplier and they indicated that any PCBs that are over six months old
should be baked prior to processing. This was never required with leaded
PCBs. 

Is anyone seeing the same condition and similar feedback from your PCB
suppliers



Joel Alexander
Quality Assurance Manager
TT APSCO, INC. 

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