Has anyone experienced an increase of delamination when processing in a 
lead free environment. Typically 4 to 6 layer pcbs during SMT reflow. We 
are using the high temp laminate suggested for our process. When we 
contacted the supplier and they indicated that any PCBs that are over six 
months old should be baked prior to processing. This was never required 
with leaded PCBs. 

Is anyone seeing the same condition and similar feedback from your PCB 
suppliers



Joel Alexander
Quality Assurance Manager
TT APSCO, INC. 

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