Hello, 

i am looking for a standard which refers to the mounting of electrolytic 
capacitors processed with lead forming. 

Actually, in IPC 610 standard, space between component base and board 
surface of Radial leads is described between 0.3 mm and 2mm's (7.1.6 
Component Mounting-Radial Leads-Vertical). However, i can not find any 
accept/defect explanation about the mounting of components with formed 
leads.
 
What should be the mounting limits of radial components if we are talking 
about formed leads. 

Thank you very much for the helps already,

Best regards

Ahmet 

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