Second trial :

TechNetters,
I am curious to learn what are current practices in terms of dimensional 
tolerances for PCB outer pads and traces.
It looks to me that IPC-A-600G has a 20% tolerance which applies to 
isolated defects like nicks, pinholes...but does not address pad and 
line width tolerances which remain part of the manufacturing file and/or 
procurement requirements.
What are current practices in that area? Subsidiary question: what 
tolerances are affected to BGA pads?

This did not seem to grab much attention...Maybe I will be more lucky 
for the second round...

Regards,

A. Grivon

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