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October 2007

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Subject:
From:
"Igoshev, Vladimir" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Igoshev, Vladimir
Date:
Mon, 15 Oct 2007 14:51:21 -0400
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text/plain
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Hi Anna,

There are quite a few of them (Dave Hillman is almost the "godfather").
You can google them, or contact me off line and I''' try to help you.

Regards,

Vladimir

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Anna Seredovaya
Sent: Monday, October 15, 2007 7:22 AM
To: [log in to unmask]
Subject: [TN] "Mixed" Soldering Process

Hello,
 
I'm looking for standard or any paper dealing with "mixed" soldering
processes: when some of board-paste-device trinity is Lead-Free while
the left include Pb.
For example, the case of LF bare board (Tg170), LF BGA, SnPb paste, LF
reflow profile... What about the reliability of such a PCBA?
 
Thanks in advance,
Ann
 

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