Thanks all for good inputs.
I think I've got enough ideas for a simple prototype test.
Plating the slots may be little tricky though.
Offliners, many thanks to you too.
/Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Donald Vischulis
Sent: den 13 oktober 2007 03:41
To: [log in to unmask]
Subject: Re: [TN] Mouuuuh!


Matthias has identified a good approach.  To progress beyond the
concept, concurrent engineering is necessary.  Production volume (can
the project support non-recurring costs for tooling), requirements for
the meniscus (how complete, percent of volume that can contain voids),
can the edges of the assembly be copper plated, etc. need to be
discussed with a fabricator to take the concept to the next level.

Don Vischulis

-----Original Message-----
>From: Matthias Mansfeld <[log in to unmask]>
>Sent: Oct 12, 2007 4:03 PM
>To: [log in to unmask]
>Subject: Re: [TN] Mouuuuh!
>
>Hmmmm,
>how many pieces an how much may it cost? Idea for higher volume "mass" 
>production...
>
>- slots plated!!! and tight fit (best capillary effect)
>- solder mask around the slots
>- boards should get good HAL (is leadfree required - if not, use SnPb 
>HAL), at least a perfectly wettable surface
>- flux abundantly
>- good preheating and then dip in a solder bath oder pull it through 
>the wave.
>
>Could work....
>
>Regards
>Matthias Mansfeld
>--
>Matthias Mansfeld Elektronik * Leiterplattenlayout Neithardtstr. 3, 
>85540 Haar; Tel.: 089/4620 093-7, Fax: -8
>Internet: http://www.mansfeld-elektronik.de GPG 
>http://www.mansfeld-elektronik.de/gnupgkey/mansfeld.asc
>
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