I haven't see your product but just knowing the board i
Hi Rush,



I haven't see your product but just knowing the board is a 20-layer 150

mils PCB with a 1.5 mil thick copper requirement for the vias it sounds

like this isn't a cheap assembly.  I guess that is the reason you're

looking for a non-destructive measurement.  Unfortunately I don't think

you are going to find a non-destructive technique for measuring the

copper thickness in vias on a fully populated PCBA.  Werner's comment

about a "classic case" is correct.  In fact I would add to his statement

and say that a non-populated PCB retention sample is always a good idea

as is non-destructive measurements on bare PCB's prior to assembly.



Regards,

George

George M. Wenger

Andrew Corporation Wireless Network Solutions

Senior Principal FMA / Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 [Office]  (732) 309-8964 [Cell]



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*

Sent: Saturday, October 13, 2007 7:30 PM

To: [log in to unmask]

Subject: Re: [TN] SV: [TN] URGENT HELP NEEDED:- non-destructive method

for via hole plating thickness



Hi Rush,

Here is a classic case as to why it is imperative to have coupons as

part of 

the panel.

you state:

20 layers, ~150 mils thick

Via holes are 20-22 mils finished; Required plating is 0.0015 min.

Also, for via holes, the finished hole size is totally unimportant-you

need 

to know the drilled hole size.

Is the required plating thickness 1.5 mils minimum? or measures how?

You also do not say whether you have problems, and what the problems

are.





Werner







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