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October 2007

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Subject:
SV: [TN] URGENT HELP NEEDED:- non-destructive method for via hole plating thickness
From:
Hfjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hfjord <[log in to unmask]>
Date:
Sat, 13 Oct 2007 23:03:31 +0200
Content-Type:
text/plain
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Gosh! Where did I get that from? Has nothing to do with Uranium. I mean 
My two rems.

-----Ursprungligt meddelande-----
Från: Hfjord [mailto:[log in to unmask]] 
Skickat: den 13 oktober 2007 22:52
Till: 'TechNet E-Mail Forum'; [log in to unmask]
Ämne: SV: [TN] URGENT HELP NEEDED:- non-destructive method for via hole
plating thickness

Don't know if Feinfocus X-ray has enough resolution, but may be worth
trying. A Feinfocus fitted with a Hamatsu image processor may fix it. There
is a contrast difference between Copper and Tin/Lead.
My two Bequerels
/Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För [log in to unmask]
Skickat: den 13 oktober 2007 18:27
Till: [log in to unmask]
Ämne: [TN] URGENT HELP NEEDED:- non-destructive method for via hole plating
thickness

Hi to all,
 
Looking for service or friendly (aren't we all) PWB manu. who has the  
capability to measure COPPER plating thickness in via holes in FINISHED
BRD.  i.e. 
with HASL in via holes.  NON-DESTRUCTIVE TESTING
 
Description of brd:-
 
20 layers
~150 mils thick
Via holes are 20-22 mils finished.
 
Required plating is 0.0015 min.
 
A few I have learnt about are CMI (probe inside the hole) & UPA  (resistance

measurement)
 
Rush
818-415-0030



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