Matthias has identified a good approach.  To progress beyond the concept, concurrent engineering is necessary.  Production volume (can the project support non-recurring costs for tooling), requirements for the meniscus (how complete, percent of volume that can contain voids), can the edges of the assembly be copper plated, etc. need to be discussed with a fabricator to take the concept to the next level.

Don Vischulis

-----Original Message-----
>From: Matthias Mansfeld <[log in to unmask]>
>Sent: Oct 12, 2007 4:03 PM
>To: [log in to unmask]
>Subject: Re: [TN] Mouuuuh!
>
>Hmmmm,
>how many pieces an how much may it cost? Idea for higher volume 
>"mass" production...
>
>- slots plated!!! and tight fit (best capillary effect)
>- solder mask around the slots
>- boards should get good HAL (is leadfree required - if not, use SnPb 
>HAL), at least a perfectly wettable surface
>- flux abundantly
>- good preheating and then dip in a solder bath oder pull it through 
>the wave.
>
>Could work....
>
>Regards
>Matthias Mansfeld
>-- 
>Matthias Mansfeld Elektronik * Leiterplattenlayout
>Neithardtstr. 3, 85540 Haar; Tel.: 089/4620 093-7, Fax: -8
>Internet: http://www.mansfeld-elektronik.de
>GPG http://www.mansfeld-elektronik.de/gnupgkey/mansfeld.asc
>
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