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October 2007

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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Thu, 11 Oct 2007 13:45:23 -0400
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fuming nitric or some commercial chemical, like dynasolv MIGHT do the  
trick....if the die is wire bonded by gold...jk
On Oct 11, 2007, at 1:08 PM, Susan Hott wrote:

> Greetings to all
> I need to dissolve the black "plastic" casing on an SOIC to see the  
> die.? Does anyone know what I can use to do this?
>
> Thanks
> Susan Mansilla Hott
> Robisan Lab
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