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October 2007

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 1 Oct 2007 13:14:46 -0500
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If the drill process is not robust enough (sharp drill/clear lase) a
small resin or glass recession or tear will occur, and this in turn will
be plated up, resulting in the plated spur. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ian Hanna
Sent: Monday, October 01, 2007 1:16 PM
To: [log in to unmask]
Subject: Re: [TN] Is This a BAD Thing?

Assuming the design has a sufficient 'anti-pad' clearance on the plane
layers spacing to adjacent conductors should not be an issue.  Class III
allows .003" maximum.  Unusual though that the glass is sheared so far
back.  There is some indication of drill tear-out though.  I wonder if
the mystery material between layers 4 and 5 has anything to do with
this?  Ian
 

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