Guys, 
 
I am vice chairman of the 5-23b committee on solderability with Dave  Hillman 
as the chairman.  I do not officially remember why this was  changed, but it 
was for a reason - not willy-nilly.  My suggestions are  either:
1. Because of some change in the J-004 standard on flux, or
2. The changed flux reduced the chance of false calls in the test.  
 
I have a reinforcing note to Dave Hillman to get you an answer.  And,  please 
review the information still carried on the committee web site:
 
_http://members.ipc.org/commReg/CommRegFile.asp?PDFTYPE=min&ComName=Component%
20and%20Wire%20Solderability%20Specification%20T.G&comm=5-23B_ 
(http://members.ipc.org/commReg/CommRegFile.asp?PDFTYPE=min&ComName=Component%20and%20Wire%20
Solderability%20Specification%20T.G&comm=5-23B) 
 
From a quick scan, I don't see where this change is called out in the  
minutes.  Again, you can review most any of the IPC committtee work, by  going as 
follows:
 
1.  IPC Web page
2.  Standards (that is under the Knowledge header)
3. Standards Development
4. Committee Home pages
5. Then, you have to be somewhat familiar with the IPC committee structure  
to know where to search.  Assembly standards tend to all be under committee  
5-20 Assembly and Joining.  J-002 is under Committee 5-23B. 
6. Try it and you will like it (Dr. Suess). 
 
Denny Fritz
MacDermid, Inc. 
 
 
In a message dated 10/31/2007 1:32:03 P.M. Eastern Daylight Time,  
[log in to unmask] writes:

New  consensus . . . Who sits on these committees?  

-----Original  Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Sue  Powers-Hartman
Sent: Wednesday, October 31, 2007 12:36 PM
To:  [log in to unmask]
Subject: [TN] Flux

The new JStd-002B 3.2.2 states  that ROL1 flux shall be used for
solderability testing, while the old Rev  JStd-002A 3.2.2 calls out ROL0
Flux.  Does anyone know why this was  changed?


 



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