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October 2007

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Mon, 29 Oct 2007 10:26:23 -0700
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That's a week answer. The real answer will cost me another royalty
donation to the Doug Paul's Defense Fund for Battered Chickens, but it
depends. The range of time could be from ASAP (a maximum one hour) to
eternity (meaning never). Some of the things to consider are as follows:

*         Laminate

*         Final surface finish

*         Solder Mask

*         Spacing

*         Component orientation

*         Assembly surface topography

*         Material compatibilities

*         Cleaning chemistries

*         Solvency capabilities

*         Flux chemistries

*         Cleaning process residuals and their chemical make-up

*         Thermal excursion exposures during processing

*         Cleanliness requirements

*         Conformal coating or not

*         Testing requirements

*         End use environment

*         Warranty issues

*         Cost

 

Dewey

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Linda Langley
Sent: Tuesday, October 23, 2007 11:40 AM
To: [log in to unmask]
Subject: [TN] cleaning concerns

 

 

Can anyone tell me or direct me to documentation that specify how long
flux residue from WS609 63/37 can be left on a board before washing?

 

I was informed that it could be left on for 7 days . 

 

Linda Langley 

Jabil Circuit 

Training Specialist 

(248) 292-6176 

 

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