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Date: | Tue, 11 Sep 2007 15:46:02 -0400 |
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Victor,
the stencil apertures are related to the pitch and not necessarily to the pad width. For a 0.281mm wide pad, I assume you have a 0.5mm pitch. IPC-7525 recommends a 0.25mm wide aperture.
Of course, the reliability is a function of the volume of solder, so if you have no other funkier parts, like 0201, leadless, 16mils pitch, I suggest you used a 6 mils thick stencil.
Regards,
Ioan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
Sent: Tuesday, September 11, 2007 3:32 PM
To: [log in to unmask]
Subject: [TN] LF Solder Paste Stencil Volume
Fellow TechNetters:
What is the guideline/require for solder paste application onto a pad
with the following dimensions:
Length: 2.213 mm and Width: 0.281 mm. A gull wing device will be
placed at this location.
Victor,
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