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September 2007

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Subject:
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tempea, Ioan
Date:
Tue, 11 Sep 2007 15:46:02 -0400
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Victor,

the stencil apertures are related to the pitch and not necessarily to the pad width. For a 0.281mm wide pad, I assume you have a 0.5mm pitch. IPC-7525 recommends a 0.25mm wide aperture.

Of course, the reliability is a function of the volume of solder, so if you have no other funkier parts, like 0201, leadless, 16mils pitch, I suggest you used a 6 mils thick stencil.

Regards,

Ioan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
Sent: Tuesday, September 11, 2007 3:32 PM
To: [log in to unmask]
Subject: [TN] LF Solder Paste Stencil Volume


Fellow TechNetters:

   What is the guideline/require for solder paste application onto a pad
with the following dimensions:
Length:   2.213 mm and Width:   0.281 mm.   A gull wing device will be
placed at this location.

Victor,

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