This is your last chance to save 10% off of registration prices!

 

Via Hole Filling Technology and Processes 

November 1 & 8, 2007 10:00 am - 11:00 am (CST)

Instructor:  Michael Carano, Electrochemicals, Inc.

 

This IPC web cast series describes the technological drivers behind the
need for via filling in a highly effective and reliable fashion for high
density, high aspect ratio printed wiring boards. Close attention is
paid to the use of these via filling materials for highly complex
circuit designs. 

 

November 1, 2007 - 10:00 am - 11:00 am (CST) 

Via Hole Filling Technology and Processes: An Overview

 

* Introduction to via filling

* What is via filling

* Technology drivers for via filling 

* Different types of via structures 

* Overview of via filling processes

* Filling via polymer materials

* Filling via plating

* Via fill by electroplating

* Theoretical considerations

* Plating additive design

* Plating process parameters

* Plating cell design

* Reliability

* Troubleshooting 

 

November 8, 2007 - 10:00 am - 11:00 am (CST)

Via Hole Filling Technology and Processes: The Rest of the Story 

 

* Introduction to via filling with polymer based materials 

* Why use polymer based materials 

* Conductive versus non-conductive via fills 

* Material considerations 

* Electrical/physical properties 

* Methods of via filling 

* Hand screening 

* Roller coating 

* Vacuum plugging equipment 

* Over metallization considerations 

* Troubleshooting 

 

Reserve your conference room and attend with colleagues, or log in on
your own from the convenience of your home or office.  It's easy and
it's inexpensive!

 

Take advantage of these savings and register by cutting and pasting
www.ipc.org/ViaHoleWC into your browser and downloading the registration
form.

 

 


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