TECHNET Archives

September 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Douglas O. Pauls" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 10 Sep 2007 15:46:54 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (68 lines)
Ioan,
In addition to the other good answers posted, you also need to keep the 
exotherms of the potting material in mind.  Some potting materials get 
very hot when reacting.  The cooler potting materials have correspondingly 
longer cure times. 

For both materials, you also need to keep in mind the CTE effects of the 
materials under components.

Doug Pauls




"Tempea, Ioan" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
09/10/2007 02:07 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Tempea, Ioan" <[log in to unmask]>


To
[log in to unmask]
cc

Subject
[TN] Conformal coating/potting DfA






Dear Technos,

what would be the Design for Assembly concerns related to products that 
will be conformally coated or potted?

Thanks,

Ioan

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
for additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815
-----------------------------------------------------


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2