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September 2007

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Subject:
From:
Gus Abu-Hamdeh <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 6 Sep 2007 13:30:39 -0700
Content-Type:
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text/plain (173 lines)
Nothing looks strange from the photos.
 
Do you plasma clean the IC before bonding?  What gas do you use?  Are
you also having problem bonding the other side (board/substrate side)?

Thanks

Gus
Maxtek Component Corporation


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: Thursday, September 06, 2007 1:17 PM
To: [log in to unmask]
Subject: Re: [TN] Semi guys, need support

Based upon a quick look at the photos and spectrum:

1. Fluorine peak in the spectrum is not desirable but some F is often
seen so formation of fluorides does not appear to be the main concern.

2. Photo 20b shows what appears to be cracking of a layer of material
overlaying the surface of the pad.  Cracking is clearly visible around
the inside edge of the bond pad and this seems to clearly indicate a
considerable amount, and a nearly continuous layer of contamination
across the bond pad. The photo indicates the use of a backscattered
electron detector, and this type of image shows an enhanced sensitivity
to atomic number, so the very dark surface of the bond pad makes me
believe a low atomic number film is on the surface.  I do not know from
which sample and from which location the spectrum was taken, but if
taken from somewhere on this bond pad, the high Carbon peak makes
organic contamination appear to be a big problem.  

2. It would be very helpful to know from what sample and sample site the
EDX data was collected.  The spectrum shows a fairly large Cl peak.
Photo 9 shows what appears to be corrosion sites or etch pits.  So
perhaps this is related to the Cl due to formation and dissolution of
AlCl3.  

3.  Photos 4 and 25b show pads that appear to exhibit scattered, and
widespread contaminated corrosion sites.  

4.  Is it possible the contamination came from the "chip trays"?  Off
gassing of anti-ESD materials and surfactants could be a source of some
contamination.

This is all I can say without further input. 





Best regards,
Leo

          
Leo M. Higgins III, Ph.D.
Sr. Vice President, Engg and Technology
ASAT, Inc. 
13809 Research Blvd., Suite 635
Austin, Texas     78750

office phone   512-249-4758
mobile           512-423-2002
[log in to unmask]
www.asat.com



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Gregory
Sent: Thursday, September 06, 2007 10:16 AM
To: [log in to unmask]
Subject: Re: [TN] Semi guys, need support


Hi Inge and Everyone!

I've got your pictures up. Go to:

http://stevezeva.homestead.com/files/RYT809205_25b.jpg

http://stevezeva.homestead.com/files/RYT809205_20b.jpg

http://stevezeva.homestead.com/files/RYT809205_4.jpg

http://stevezeva.homestead.com/files/RYT809205_9.jpg

http://stevezeva.homestead.com/files/Spectrum_RYT809205_flat.jpg

Sorry I can't help with any input, but this kind of stuff is w-a-a-a-y
out of my league...

Steve

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Thursday, September 06, 2007 9:01 AM
To: [log in to unmask]
Subject: [TN] Semi guys, need support

 25 micron gold ball bonding bad yield, ball lifts, poor adhesion on Al
pads. Triple diff line tranceiver chip. Weird micrographic exteriour,
EDAX gives C,F,O, Cl,Cu,Al,Fe. Cu can be ppm alloy but the others
unwanted on semi chip bond pads I think. 1kV SEI SEM reveals strange
superficial structure. Chip not contaminated by us, fresh opened chip
trays show this face. Question: what semi manufacturing problem can this
be? Will post a few pics to Steve's gallery.

TrikeMan? 

/Inge

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