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Subject:	Semi guys, need support
From:	Hernefjord Ingemar <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:	Thu, 6 Sep 2007 16:00:32 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (22 lines)

 25 micron gold ball bonding bad yield, ball lifts, poor adhesion on Al
pads. Triple diff line tranceiver chip. Weird micrographic exteriour,
EDAX gives C,F,O, Cl,Cu,Al,Fe. Cu can be ppm alloy but the others
unwanted on semi chip bond pads I think. 1kV SEI SEM reveals strange
superficial structure. Chip not contaminated by us, fresh opened chip
trays show this face. Question: what semi manufacturing problem can this
be? Will post a few pics to Steve's gallery.

TrikeMan? 

/Inge

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