Hello,
 
While soldering SMD passives (0805, 1206 packages) onto Tin/Lead finished board, the operator noticed the solder bubbles as it melt. On further heating, the good solder fillet is formed between the termination and the solder pad. However, a tiny "dimple" is left in the centre of the solder joint. While not all has tiny "dimple" left behind, bubbles do occur during most of the operation.
 
What could be the cause as there is no change to the material used (solder, flux, soldering iron, etc)? 
 
Sometimes back, someone asked about blowholes and the cause is that it is due organics in electroplating. As my board is Tin/lead finish, is the cause the same? 
 
Thanks and regards,
Wee Mei
 
 

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