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September 2007

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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Wed, 26 Sep 2007 15:11:18 -0400
Content-Type:
text/plain
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text/plain (74 lines)
check vib requirements for telecom, DIMM (angled or not) may need to  
comply...Intel may have packaging test std on web for qualification...jk
On Sep 26, 2007, at 12:36 PM, John Burke wrote:

> Hi Technet'rs,
>
>
>
> I need a little help on what tests there are for DIMM modules for  
> computer
> memory (DDR2 etc)
>
>
>
> It would appear that there are all number of drop, twist and  
> bending tests
> done by the industry and I need some enlightening in this area.
>
>
>
> If any of you could point me to standards, or failing that, the  
> testing
> required typically by most companies, I would be grateful.
>
>
>
> Kind regards,
>
>
>
> John Burke
>
>
>
>
>
>
>
> John Burke
>
>
>
> (408) 515 4992
>
>
>
>
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