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September 2007

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Subject:
From:
"Creswick, Steven" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Creswick, Steven
Date:
Wed, 26 Sep 2007 08:59:11 -0400
Content-Type:
text/plain
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text/plain (54 lines)
Wire bonding related, as in cratering of bond pad on a device?

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, September 25, 2007 6:17 PM
To: [log in to unmask]
Subject: [TN] Pad Cratering

Hi All,
Does anybody have a good picture(s) of 'pad cratering' I could have for
my 
workshops?


Thans,
Werner



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