I just got a question from one of our engineers about the heat absorbing properties of some pads that are being used as heat sinks for some SMD components. 

Is there a "fatal" temperature that will always cause the pad to lift off the board regardless of pad size?  How does pad size affect a pads ability to absorb heat and therefore not lift?  How is pad integrity affected by repeated shocks (i.e. repeated rework)?

Thanks....

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