Werner, thanks.  We're doing thermal studies right now and that's what's
being indicated.  
 

Bob 

 

________________________________

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Tuesday, September 18, 2007 4:17 PM
To: Croslin, Robert; [log in to unmask]
Subject: Re: [TN] Trace Peel on FR4


Hi Bob,
I sure do not of any industry document addressing your issues.
With traces running this hot, there certainly is a reduction in peel
strength. On the other hand, the CTE's of the FR-4 and the ED-Cu are
very close-unless you have frequent on/off's, the T's of the PCB and the
Cu traces will not be that much different either. So. whatever thermal
ecpansion mismatch may exist, either in steady-state or dynamically,
should be small enough to be accommodated by the ED-Cu ductility.

Werner



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