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September 2007

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Subject:
From:
Michael F Greaves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Michael F Greaves <[log in to unmask]>
Date:
Thu, 13 Sep 2007 14:57:57 -0400
Content-Type:
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text/plain (32 lines)
On 2007-09-13 12:58, John Burke wrote:
> I am assuming that the close up shots are Z axis sections?

Yes.  Sorry, I should have described them better.

> Which if they are, and those are indeed inner layers, the
> board is showing signs of unusual localized deformation since
> the "two halves" of the break are not aligned, and if this is
> indeed an inner layer section, they should be, broken or not.

Yes, I believe there are two phases leading to the final
condition:  an inital defect (still very conductive), followed
by later separation (higher R or open), possibly under stress.

> Have you taken a look at the test fixture for the final board
> assembly? You can sometimes get very bad local board
> deformation due to uneven pusher pin distribution.

No but that is an interesting suggestion, thanks.

Mike

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