On 2007-09-13 08:01, Stadem, Richard D. wrote:
> Technet strips attachments.

Thanks everyone.  I was surprised to find an attachment
facility there on the post-message page.

I've just had them put on a web server:

http://tumladen.net/pcb/pic00041.jpg
http://tumladen.net/pcb/pic06334.jpg
http://tumladen.net/pcb/pic18467.jpg
http://tumladen.net/pcb/pic26500.jpg

> Has anyone experienced the defects illustrated in the 4
> attached images? We are confident that these were properly
> tested at bare-board electrical test, and that these apparent
> opens must have completely separated later.
> Assemblies show some failures due to high-R at these kinds of
> defects (this one was a complete open).  We don't believe
> they were visible at AOI, but are attempting to replicate
> them and verify this.  We are guessing that a foil weakness
> existed at lamination, but failure did not occur until
> subsequent thermal or mechanical stress during assembly or in
> the field.
>
> Anyone have any thoughts?  Thanks very much.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------