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September 2007

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Subject:
From:
"Thomas, Ian (Ian) %" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Thomas, Ian (Ian) %
Date:
Thu, 13 Sep 2007 09:08:32 +0100
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 Unleaded ALPHA 0M325, PCB is gold finish.

Thanks

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Cheryl L. Johnson
Sent: 12 September 2007 19:24
To: [log in to unmask]
Subject: Re: [TN] Thermal issue's with unleaded solder paste.

What specific lead-free solder and pcb finish are you using?

--
Cheryl Johnson
(303) 485-8829 home
(303) 809-5815 cell

 -------------- Original message ----------------------
From: "Thomas, Ian (Ian) %" <[log in to unmask]>
> Hi, Need some useful advice regarding a current design.
> I have a 12 layer FR4-370HR PCB, using stacked uvia's in pad which 
> connect to planes on layers 2 & 3 which are flooded with no thermal 
> relief.
> 
> We have seen no issue's with leaded assembly, but on transferring over

> to un-lead, we are seeing solder issue's with the BGA's (0.5mm pitch) 
> on assembly and also rework issuse's with 90% of the other components 
> (including
> 0402's) in getting them off the board.
> 
> Our first thoughts are to thermally relieve all the micro via's, but 
> there are issue's because this may leave you with only one spoke on a 
> pin in some areas.
> 
> Has any seen these issue's before?
> 
> Thank's in advance.
> 
> Ian
> LSI Technology (Mobility)
> 
> 
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