.....WOW.......that was an incredible response.......and it is not even Friday yet, even in China where I am now.
Best regards,
Leo
Leo M. Higgins III, Ph.D.
Sr. Vice President, Engg and Technology
ASAT, Inc.
13809 Research Blvd., Suite 635
Austin, Texas 78750
office phone 512-249-4758
mobile 512-423-2002
[log in to unmask]
www.asat.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Hernefjord Ingemar
Sent: Thursday, September 13, 2007 1:31 AM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] Semi guys, need support, conclusion
How did you know? Minority and majority carriers recombine and the gap evidence causes photon emission. We thought that after a long time all this loss of carriers will empty the chips, so we charge the chips little extra by utilizing the photon irradiation from the sun by reversing the process. That's why we place the chips on the sill for some weeks before using them. The problem is that there is so little sun during the winter. Therefore, our customers use to ask for products with sunchips.
/Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: den 12 september 2007 17:17
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] Semi guys, need support, conclusion
After looking at the 2nd photo Steve posted, I'm wondering if the source of the cracking material is simply the crust of that pigeon pie to which you refer.......Just where die you store those die.....on the window sill?
Best regards,
Leo
Leo M. Higgins III, Ph.D.
Sr. Vice President, Engg and Technology
ASAT, Inc.
13809 Research Blvd., Suite 635
Austin, Texas 78750
office phone 512-249-4758
mobile 512-423-2002
[log in to unmask]
www.asat.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Hfjord
Sent: Wednesday, September 12, 2007 10:11 AM
To: [log in to unmask]
Subject: [TN] SV: [TN] Semi guys, need support, conclusion
That pigeon wasn't chicken
/Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Whittaker, Dewey (EHCOE)
Skickat: den 12 september 2007 16:05
Till: [log in to unmask]
Ämne: Re: [TN] Semi guys, need support, conclusion
Yes, what a coop d'etat.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Wednesday, September 12, 2007 6:50 AM
To: [log in to unmask]
Subject: Re: [TN] Semi guys, need support, conclusion
Ho-Ho-Ho! You PSP-doodle...he-he..at least you didn't make a pigeon pie...
/Inge
-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: den 12 september 2007 15:38
To: TechNet E-Mail Forum; Hernefjord Ingemar
Subject: RE: [TN] Semi guys, need support, conclusion
Hi Inge!
The pidgeon just landed on my desk and brought me your pictures. They're right here:
http://stevezeva.homestead.com/files/RYT809205_32_MC10616.jpg
http://stevezeva.homestead.com/files/RYT809205_33_MC10616.jpg
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Wednesday, September 12, 2007 6:28 AM
To: [log in to unmask]
Subject: Re: [TN] Semi guys, need support, conclusion
Hi Leo,
your reputation is in danger (kidding). I pasted your comment in a document for our purchaser. Says "if you don't believe me, see what Dr Higgins says! Basta! ". Now, little more seriously...I got kind of confirmation on your comments regarding circumperiferical microcracks.
There ARE cracks, all around! Must be caused by mismatching materials.
Your insight in semi world is worth a lot, I've placed your name on a map named 'semi mysteries'.
I'll send a SEM image asap to Steve for publication, depends on when I get a longdistance pigeon.
Have a nice day, sir!
/Inge
-----Original Message-----
From: Leo Higgins [mailto:[log in to unmask]]
Sent: den 12 september 2007 12:12
To: Hernefjord Ingemar; TechNet E-Mail Forum
Subject: RE: [TN] Semi guys, need support, conclusion
Hi Inge,
Last comment after your last bit of info. Al-1%Cu bond pads can require more care and control of wire bonding process parameters than Al or Al-1% Si bond pads to be sure to form an intermetallic layer at the Au ball to pad interface. Even though the solubility of Cu in Al is supposed to be about 5%, the Cu does tend to collect at microstructural triple points, where it effectively hardens the Al and reduces the lateral deformation of the Al pad during bonding. The presence of the Al and Cu in the very thin pad layer can result in a very nice galvanic cell during dicing due to the cooling water, or due to environmental humidity, leading to corrosion which is aggravated by the presence of halogens. Your supplier A appears to be using pure Al pads and supplier B appears to be using Al + x%Cu pads. As previously noted the fluorine could be a contaminant from plasma processing, or could be from a fluorinated passivation layer, if present. I also think the C level shown of the spectrum could be a contributor to the poor bonding.
The link below provides connection to a short app note on scanning Auger depth profiling on a good and a bad bond pad, and may represent a similar problem.
http://www.eaglabs.com/files/appnotes/AN332.pdf
Best regards,
Leo
Leo M. Higgins III, Ph.D.
Sr. Vice President, Engg and Technology
ASAT, Inc.
13809 Research Blvd., Suite 635
Austin, Texas 78750
office phone 512-249-4758
mobile 512-423-2002
[log in to unmask]
www.asat.com
-----Original Message-----
From: Hernefjord Ingemar [mailto:[log in to unmask]]
Sent: Wednesday, September 12, 2007 1:16 AM
To: TechNet E-Mail Forum; Leo Higgins
Subject: RE: [TN] Semi guys, need support, conclusion
Thanks all for your help,
especially from Leo.
We found that we had two batches from the semi suppliers. The chips ought to have same semi manufacturer's part number, but the two chip houses had different codes. Supplier A had no Fluorine peaks, nor Copper. Supplier B had both Fluorine and Copper peaks (quantification was not done). Supplier A was excellent for wire bonding, supplier B was hopelessly bad. So, the conclusion is, that the presence of F and Cu was the reason for bad bondability. I can still not explain the exact cause for bond lifting, think Leo's fluorine/fluorid explanation may be correct. If the Copper added to the bad bondability, I don't know. The Copper presence was percentage rather than ppm, which may have reinforced the problem.
Anyway, one batch is scrapped, the other is used, production is started again.
Sensmoral: use F for your teeth and avoid bad coppers...
/Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: den 6 september 2007 22:17
To: [log in to unmask]
Subject: Re: [TN] Semi guys, need support
Based upon a quick look at the photos and spectrum:
1. Fluorine peak in the spectrum is not desirable but some F is often seen so formation of fluorides does not appear to be the main concern.
2. Photo 20b shows what appears to be cracking of a layer of material overlaying the surface of the pad. Cracking is clearly visible around the inside edge of the bond pad and this seems to clearly indicate a considerable amount, and a nearly continuous layer of contamination across the bond pad. The photo indicates the use of a backscattered electron detector, and this type of image shows an enhanced sensitivity to atomic number, so the very dark surface of the bond pad makes me believe a low atomic number film is on the surface. I do not know from which sample and from which location the spectrum was taken, but if taken from somewhere on this bond pad, the high Carbon peak makes organic contamination appear to be a big problem.
2. It would be very helpful to know from what sample and sample site the EDX data was collected. The spectrum shows a fairly large Cl peak.
Photo 9 shows what appears to be corrosion sites or etch pits. So perhaps this is related to the Cl due to formation and dissolution of AlCl3.
3. Photos 4 and 25b show pads that appear to exhibit scattered, and widespread contaminated corrosion sites.
4. Is it possible the contamination came from the "chip trays"? Off gassing of anti-ESD materials and surfactants could be a source of some contamination.
This is all I can say without further input.
Best regards,
Leo
Leo M. Higgins III, Ph.D.
Sr. Vice President, Engg and Technology
ASAT, Inc.
13809 Research Blvd., Suite 635
Austin, Texas 78750
office phone 512-249-4758
mobile 512-423-2002
[log in to unmask]
www.asat.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Gregory
Sent: Thursday, September 06, 2007 10:16 AM
To: [log in to unmask]
Subject: Re: [TN] Semi guys, need support
Hi Inge and Everyone!
I've got your pictures up. Go to:
http://stevezeva.homestead.com/files/RYT809205_25b.jpg
http://stevezeva.homestead.com/files/RYT809205_20b.jpg
http://stevezeva.homestead.com/files/RYT809205_4.jpg
http://stevezeva.homestead.com/files/RYT809205_9.jpg
http://stevezeva.homestead.com/files/Spectrum_RYT809205_flat.jpg
Sorry I can't help with any input, but this kind of stuff is w-a-a-a-y out of my league...
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Thursday, September 06, 2007 9:01 AM
To: [log in to unmask]
Subject: [TN] Semi guys, need support
25 micron gold ball bonding bad yield, ball lifts, poor adhesion on Al pads. Triple diff line tranceiver chip. Weird micrographic exteriour, EDAX gives C,F,O, Cl,Cu,Al,Fe. Cu can be ppm alloy but the others unwanted on semi chip bond pads I think. 1kV SEI SEM reveals strange superficial structure. Chip not contaminated by us, fresh opened chip trays show this face. Question: what semi manufacturing problem can this be? Will post a few pics to Steve's gallery.
TrikeMan?
/Inge
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