Michael,

The attachments do not come through on the link - I am sure Steve will post
them for you if you send them to him..

John

 
 
John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Michael F Greaves
Sent: Wednesday, September 12, 2007 2:22 PM
To: [log in to unmask]
Subject: [TN] Inner trace defects post-fab/BBT

This is a multi-part message in MIME format.

Has anyone experienced the defects illustrated in the 4 attached images?
We are confident that these were properly tested at bare-board electrical
test, and that these apparent opens must have completely separated later.
Assemblies show some failures due to high-R at these kinds of defects (this
one was a complete open).  We don't believe they were visible at AOI, but
are attempting to replicate them and verify this.  We are guessing that a
foil
weakness existed at lamination, but failure did not occur until subsequent
thermal or mechanical stress during assembly or in the field.

Anyone have any thoughts?  Thanks very much.



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