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September 2007

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 25 Sep 2007 08:43:00 -0500
Content-Type:
text/plain
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text/plain (113 lines)
Are you referring to the solder agglomeration test? 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of antonio
Sent: Tuesday, September 25, 2007 7:50 AM
To: [log in to unmask]
Subject: Re: [TN] Question about "Solder Pool Test"

No, I mean "Solder Pool Test" . It is a test from IEC 61189-5 .

Thanks

Antonio



Bev Christian escreveu:
> Antonio,
> Do you mean "solder pot"?  Usually one has a small ceramic or inert 
> metal pot into which solder is put and melted (for the solder float 
> test for boards) and solder dip testing (boards and components) and 
> for the other solderability tests mentioned in IPC-J-002 and J-003.
> Bev
> RIM
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of antonio
> Sent: Tuesday, September 25, 2007 8:35 AM
> To: [log in to unmask]
> Subject: [TN] Question about "Solder Pool Test"
>
> Please
>
> I need to translate "Solder Pool Test"  to Portuguese but it sounds 
> weird. Does anyone know a similar name in english the way I can find a

> better translation!
>
> Thanks
>
> Antonio
> Brasil
>
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