I just got a question from one of our engineers about the heat absorbing properties of some pads that are being used as heat sinks for some SMD components.
Is there a "fatal" temperature that will always cause the pad to lift off the board regardless of pad size? How does pad size affect a pads ability to absorb heat and therefore not lift? How is pad integrity affected by repeated shocks (i.e. repeated rework)?
Thanks....
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------