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Michael,
The attachments do not come through on the link - I am sure Steve will post
them for you if you send them to him..
John
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Michael F Greaves
Sent: Wednesday, September 12, 2007 2:22 PM
To: [log in to unmask]
Subject: [TN] Inner trace defects post-fab/BBT
This is a multi-part message in MIME format.
Has anyone experienced the defects illustrated in the 4 attached images?
We are confident that these were properly tested at bare-board electrical
test, and that these apparent opens must have completely separated later.
Assemblies show some failures due to high-R at these kinds of defects (this
one was a complete open). We don't believe they were visible at AOI, but
are attempting to replicate them and verify this. We are guessing that a
foil
weakness existed at lamination, but failure did not occur until subsequent
thermal or mechanical stress during assembly or in the field.
Anyone have any thoughts? Thanks very much.
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Technet Mail List provided as a service by IPC using LISTSERV 15.0
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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