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August 2007

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Subject:
From:
"McGlaughlin, Jeffrey A" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, McGlaughlin, Jeffrey A
Date:
Wed, 1 Aug 2007 06:44:54 -0400
Content-Type:
text/plain
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text/plain (70 lines)
It could be a warpage issue, have you measured the amount of bow in the
edge connector of the modules? This need to be much less than the
0.0075"/inch allowed by the IPC Spec. An over all max of about
0.009"-0.012" should be held in the edge connector region.

Jeffrey McGlaughlin, CID 
Engineering Designer 
Battelle 
505 King Avenue 
Columbus Ohio 43201-2693 
(614)424-7582 Phone 
(614)458-7582 Fax 



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ralph Rottnick
Sent: Wednesday, August 01, 2007 5:14 AM
To: [log in to unmask]
Subject: [TN] Problems with Memeory modules and sockets

Hi all,
I got a feedback from the market that some modules are causing problems 
during insertion to sockets. Significant is that the problems occur just
with 
PCBs from one supplier. I made correlation between different suppliers
but I 
could not find differences in any dimensions. All of the boards are not 
chamfered. Thickness is always within spec of 1.27 +/-0.1 mm. The boards

have 240 pins.

Is anybody out there who has experience in that? Are there any
influences 
related to core materials, gold hardness, gold finger design? Or is this
more 
socket related?

What are potential rootcauses?

Thanks in advance.
Ralph

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