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August 2007

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 9 Aug 2007 10:01:03 -0500
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IPC-D-279? 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of weiner, mickey
Sent: Thursday, August 09, 2007 9:06 AM
To: [log in to unmask]
Subject: Re: [TN] IPC-A-600F, Sec 4.2.6, Core Bond to
Plated-Through-Hole Wall

 
Hi Werner,
What is IPC-D-270  ?
It is not even listed in the standards revision list.  

 
Mickey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Thursday, August 09, 2007 4:43 PM
To: [log in to unmask]
Subject: Re: [TN] IPC-A-600F, Sec 4.2.6, Core Bond to
Plated-Through-Hole Wall

Hi Victor,
There is lots more information at IPC-D-270, appendix B.



Werner



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